Unisem-Advanpack Technologies Selects SUSS MicroTec Lithography Tools for Solder Bump Production

Solder wafer bumping is a packaging approach that offers manyoptions to the manufacturer of integrated devices and provides arobust and functional interconnect solution that preserves highperformance operation. As an enabling solution for the ultimateminiaturization of components, solder bumping has emerged as amainstream solution to advanced packaging requirements.

"As a wafer bumping service provider we must constantly keep upwith advances in manufacturing technology for next generation chips.SUSS MicroTec lithography technology meets this key performancecriteria and is instrumental for our successful offering of solderbumping and copper pillar bumping services in a highly competitivemarket environment", comments SC Lau, the General Manager of UnisemAdvanpack Technologies.

SUSS full-field exposure systems are designed to align and exposethe entire wafer in one step leading to a significant reduction ofprocess cycle time. The Gamma systems are efficient cluster trackscapable of employing leading technology for wafer coat/bake anddevelop processes while maintaining all the process flexibility forwhich SUSS MicroTec has been recognized.

About SUSS MicroTec

SUSS MicroTec (FWB:SMH)(GER:SMH) is a leading supplier ofproduction, process and test technology for the semiconductorindustry. SUSS maintains its leadership position with over 7,000systems installed worldwide. SUSS products include coating developingsystems, 1X full-field lithography (1XFFL) systems, substrate bonders,flip-chip bonders and probe systems. Headquartered in Munich, Germany,SUSS has 5 international manufacturing sites and provides support fromsales and service centers in North America, Europe, Asia and Japan.For more information, please visit http://www.suss.com

About Unisem-Advanpack Technologies

Unisem-Advanpack Technologies Sdn Bhd, a joint venture betweenUnisem (M) Berhad and Advanpack Solutions Pte Ltd., located in Ipoh,Malaysia, is one of the first independent wafer bumping serviceproviders in Malaysia. Unisem (M) Berhad, a leading semiconductorpackaging and test services company in Malaysia, has its mainpackaging and test facilities in Ipoh, Malaysia with additionalpackaging and testing facilities in Wales, United Kingdom. Unisemoffers an integrated suite of packaging and test services forsemiconductor companies such as wafer probe, a wide range of leadframeand substrate IC packaging, high-end RF and mix-signal test, tape &reel and drop-shipment services. http://www.unisem.com.my

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