Applied Materials to Host Technology Forum on Scaling Challenges for Sub-45nm Nodes

Panelists will share their views on what will be required tomanufacture 45nm and beyond geometries when traditional scalingtechniques are no longer applicable. The experts will discuss anddebate the following topics:

-- What is the "real" status of high k gates, strained silicon,
and other new modules for less than or equal to 45nm?

-- How are today's consumer-driven economics impacting scaling?

-- Can hardmasks, restrictive design rules, and extensive OPC
delay immersion litho?

-- What key innovations are needed to make 32nm and 22nm
successful for the industry?

Who:

Dr. Ghavam Shahidi, Fellow, Director of High Performance Logic, IBM
Dr. Tahir Ghani, 45nm Node Program Manager, Intel
Dr. Thomas Skotnicki, Advanced Devices Program Manager, ST
Dr. Tom Bonifield, Fellow, Interconnect Process Integration, TI
Dr. Carlos Diaz, Deputy Director, Logic Technology Division, TSMC
Dr. Mark Pinto, Senior Vice President and Chief Technology Officer,
Applied Materials

Moderator, Professor Scott Thompson, University of Florida

When: Tuesday, Dec. 6, 2005
Where: Jurys Washington Hotel, Doyle Room
1500 New Hampshire Ave NW, Washington, DC 20036
Agenda: 5:15 Shuttles from Washington Hilton (at the Terrace Level)
5:30 Buffet dinner
6:05 Symposium and Q&A
7:15 Return to Washington Hilton

To Attend: Contact Connie Duncan at 408-563-6209 orconnie_duncan@amat.com.

To Register: Visithttp://www.appliedmaterials.com/2005_DC_Symposium/index.html.

Applied Materials, Inc. (Nasdaq: AMAT), headquartered in SantaClara, California, is the largest supplier of equipment and servicesto the global semiconductor industry. Applied Materials' website iswww.appliedmaterials.com.