AMI Semiconductor's XPressArray-II Wins DesignCon DesignVision Award

AMI Semiconductor's XPressArray-II Wins DesignCon DesignVision Award for Best Structured/Platform ASIC, FPGA or PLD Design Tool

    Business Editors/Technology Writers
    DesignCon 2005

    POCATELLO, Idaho--(BUSINESS WIRE)--Feb. 3, 2005--

Company's Next-Generation Structured ASIC Beats Outs FPGA Competition
    AMI Semiconductor (Nasdaq:AMIS), a designer and manufacturer of state-of-the-art structured digital and integrated mixed-signal products, today announced its XPressArray-II(R) (XPA-II) structured ASIC technology has been selected as the winner of the first DesignCon DesignVision Award in the structured/platform ASIC, FPGA and PLD Design tool category.
    "The AMIS XPA-II is highly competitive in the market, providing customers with the best high performance, low power structured ASIC platform available today, while offering a huge cost advantage over similar FPGA solutions," stated Vince Hopkin, vice president of the structured digital products group at AMIS. "We are proud of this accomplishment and look forward to continuing to offer the industry compelling ASIC and FPGA conversion solutions."
    The DesignVision Awards recognize companies for recent products and services that have added a new dimension, not only to the electronic design industry, but to society as a whole. Award-winning products and services were chosen from among nominees in several categories. Entries were judged and winners were selected according to innovation, uniqueness, market impact, customer benefit, and value to society.
    The DesignCon DesignVision Awards ceremony was held Feb. 1, 2005 during the DesignCon conference in Santa Clara, Calif.

    About XPA-II

    The newest addition to the AMIS XPressArray product family, XPA-II is a 1.5V/1.2V high performance, low power, low cost structured ASIC and is the only true drop in, pin-for-pin replacement for current generation FPGAs. Based on a hybrid fabrication process, XPA-II combines advanced 0.15 micron TSMC process technology with programmable metal in AMI Semiconductor's state-of-the-art manufacturing facility to deliver leading-edge solutions with low NRE and accelerated time-to-market.
    XPA-II is an ideal platform for mid-density ASIC design and is an optimal solution for applications such as wireless and wired networking infrastructure, storage systems, printers, medical ultrasound/imaging systems, military/aerospace, communications, or any other application utilizing FPGAs or ASICs.

    About AMI Semiconductor

    AMI Semiconductor (AMIS) is a leader in the design and manufacture of silicon solutions for the real world. As a widely recognized innovator in state-of-the-art integrated mixed-signal products, mixed-signal foundry services and structured digital products, AMIS is committed to providing customers with the optimal value, quickest time-to-market semiconductor solutions. Offering unparalleled manufacturing flexibility and dedication to customer service, AMI Semiconductor operates globally with headquarters in Pocatello, Idaho, European corporate offices in Oudenaarde, Belgium, and a network of sales and design centers located in the key markets of North America, Europe and the Asia Pacific region.

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CONTACT: AMI Semiconductor, Pocatello In the United States Contact: Tamera Drake, 208-234-6890 tamera_drake@amis.com or In Europe Contact: Pinnacle Marketing Simon Flatt, +44.20.8869.9229 simon@pinnacle-marketing.com or Shelton Helen Garrett, 972-239-5119 x 201 hgarrett@sheltongroup.com

KEYWORD: CALIFORNIA IDAHO TRACK INDUSTRY KEYWORD: HARDWARE MANUFACTURING TRADESHOW PRODUCT SOURCE: AMI Semiconductor

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