Kulicke & Soffa to Participate in SEMICON Southeast Asia 2019

Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa”, "K&S” or the "Company”), announced today that it will be participating at the SEMICON Southeast Asia (SEA) 2019 trade show at MITEC in Kuala Lumpur, Malaysia, from May 7 through 9, 2019.

Kulicke & Soffa’s Hybrid equipment will be featured at the SMART Manufacturing pavilion along with other equipment forming the manufacturing transformation from wafer processing to electronics packaging. In collaboration with a third party, there will be an Augmented Reality (AR) demonstration on K&S’s Wedge Bonder bondhead visual maintenance process.

Chan Pin Chong, Kulicke & Soffa’s Senior Vice President for EA/APMR & Wedge Bonder Business Units, said, "K&S is continuing to partner with suppliers that can provide closed loop process monitoring. Closed loop feedback provides real time adjustments to the complex processes in a smart factory to ensure delivery of products of the highest quality. Similarly, augmented reality (AR) is likely to become more pervasive in manufacturing as a tool to support the complex assembly lines and enhance user experience.”

Chan Pin will deliver a presentation on the Smart Backend Assembly Factory for Industry 4.0 as well as High Accuracy Surface Mount Technologies Capability for Advanced Packaging Embedded Technologies at the Advanced Packaging Technical Forum on May 8, 2019, organized by SEMI SEA.

Customers could visit K&S’s hospitality booth #602 to discuss more on its full range of assembly solutions.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)

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