Kulicke & Soffa to Participate at SEMICON China 2020

Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) ("Kulicke & Soffa”, "K&S” or "Company”), announced today that it will be exhibiting at the SEMICON China 2020 trade show in Shanghai, China, from June 27 to 29.

The new ULTRALUX™ automatic wire bonder along with the POWER-C™ wedge bonder will debut at the trade show. The ULTRALUX™ wire bonder utilizes the latest technologies and material which offers cost-of-ownership advantage, delivering high productivity and yield. Its quick LED suite ensures time to market optimization with quick bond, stitch and loop processes.

K&S’s new POWER-C™ wedge bonder is built specifically for single-row TO package power devices. The bonder is engineered with a proven and powerful direct-drive motion system, bondhead, ultrasonic generator system and wire feeding mechanism. Its expanded pattern recognition capabilities deliver industry leading productivity and reliability. Other K&S solutions such as the RAPID™ Pro GEN-S series ball bonder, capillaries and dicing blades will also be showcased.

Nelson Wong, Kulicke & Soffa’s Senior Vice President of Global Sales, said, "Over the past several months, we continued our commitment to ongoing product development and our long-term technology roadmap. This approach allows us to continue delivering innovative and high-performance solutions directly supporting the rapid pace of technological advancements in areas such as smart manufacturing, 5G, IoT, electric vehicles and next-generation displays.”

Customers can see the full assembly of solutions at the SEMICON China trade show in Shanghai, China, Hall E3, Booth #3417 or visit K&S’s virtual exhibition booth.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement - creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices.

Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future (www.kns.com).

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