Invitation to Okmetic's Interim report briefing on 21 April 2016

OKMETIC OYJ     STOCK EXCHANGE RELEASE       11 APRIL 2016    AT 1.00 P.M.

INVITATION TO OKMETIC'S INTERIM REPORT BRIEFING ON 21 APRIL 2016

Okmetic Oyj will publish its interim report for January-March 2016 on Thursday, 21 April 2016 at 8.00 a.m. Finnish time (EEST).

A briefing for analysts, investors and media will take place on the same day, 21 April 2016 at 8.30 a.m. in Helsinki Stock Exchange building, Fabianinkatu 14, Helsinki (2nd floor, entrance via Nasdaq's reception).

The result will be presented by President Kai Seikku.

Participants are kindly requested to register by email to communications@okmetic.com or by telephone to +358 9 5028 0406/Marika Mäntymaa.

OKMETIC OYJ

Juha Jaatinen
Senior Vice President, Finance, IT and Communications

For further information, please contact:

Senior Vice President, Finance, IT and Communications Juha Jaatinen
tel. +358 9 5028 0286, email: juha.jaatinen@okmetic.com

Okmetic supplies tailored, high value-added silicon wafers to be used in the manufacture of sensors as well as discrete semiconductors and analog circuits. Okmetic's strategic objective is profitable growth driven by a product portfolio designed to meet customers' current and future technology needs. The core of the company's operations is being genuinely close to the customers and understanding their needs and processes.

Okmetic's global sales network, extensive portfolio of high value-added products, in-depth knowledge of crystal growing, long-term product development projects, as well as efficient and flexible production create prerequisites for achieving the strategic targets. The company's headquarters is located in Finland, where the majority of the company's silicon wafers is manufactured. In addition to in-house manufacture, Okmetic has contract manufacturing in Japan and China. Okmetic's shares are listed on Nasdaq Helsinki Ltd under the code OKM1V. For more information on the company, please visit our website at www.okmetic.com.