Global Substrate-Like PCB Market Forecast to 2024: Opportunities in the Rising Adoption of SLP Technology By Smartphone Players Owing to Transition From 4G to 5G Technology

DUBLIN, Jan. 21, 2019 /PRNewswire/ --

The "Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024" report has been added to ResearchAndMarkets.com's offering.

The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period.

Substrate-like PCB (SLP) is a term that describes the transition of a PCB-board into a product with package substrate-like features. SLP requires line width/line spacing up to 30/30 m, which allows to reduce the size of the mainboard and make space for other components such as a bigger battery in the case of smartphones. As the semiconductor industry trends are affecting the semiconductor package and package-to-board interconnect level, performance-driven applications such as PCs and smartphones are giving way to functional applications that are plotting the semiconductor industry's future course.

The high adoption of SLPS by leading OEMs, surge in demand for consumer electronics and wearable devices, and impactful benefits of SLPS are the factors driving the growth of the substrate-like PCB market. However, the higher setup cost associated with SLP is the major factor that restrains the growth of the substrate-like PCB market. Increasing use of advanced printed circuit boards in high-end technology-based products, rising adoption of SLP by smartphone players owing to transition from 4G to 5G technology, growing use of mSAP and SAP processes in PCB manufacturing is expected to provide growth opportunities to the substrate-like PCB market players during the forecast period. Moreover, the increasing complexity of printed circuit boards pose challenges to the substrate-like PCB market.

The line/space of 25/25 & 30/30 m is largely required in consumer electronics applications. Smartphone manufacturers such Apple and Samsung have adopted SLPs with 25/25 and 30/30 m line/space in their smartphones. SLPs find their applications in computing and communications, automotive, and medical devices as well. Due to the thinner and smaller area, it can leave more space for other components. Most of the consumer electronic devices, such as smartphones and smart bands, are battery operated and require more space.

Key Topics Covered:

1 Introduction

2 Research Methodology

3 Executive Summary

4 Premium Insights
4.1 Attractive Opportunities in Substrate-Like PCB Market
4.2 Substrate Like PCB Market in APAC, By Application and Country
4.3 Country-Wise Substrate-Like PCB Market Growth Rate

5 Market Overview
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 High Adoption of SLPs By Leading Oems
5.2.1.2 Surge in Demand for Smart Consumer Electronics and Wearable Devices
5.2.1.3 Impactful Benefits of SLPs
5.2.2 Restraints
5.2.2.1 Higher Setup Costs Associated With SLPs
5.2.3 Opportunities
5.2.3.1 Increasing Use of Advanced Printed Circuit Boards in High-End Technology-Based Products
5.2.3.2 Rising Adoption of SLP Technology By Smartphone Players Owing to Transition From 4G to 5G Technology
5.2.3.3 Growing Use of Msap and Sap Processes in PCB Manufacturing
5.2.4 Challenges
5.2.4.1 Increasing Complexity of Printed Circuit Boards

6 Substrate-Like PCB Market, By Line/Space
6.1 Introduction
6.2 25/25m and 30/30m Line/Space
6.2.1 25/25m & 30/30m Line/Space Segment Dominate SLP Market, in Terms of Size, Owing to the Rising Adoption of Miniature Devices
6.3 Less Than 25/25 m Line/Space
6.3.1 Substantial Growth Rate of Market for SLPs With Less Than 25/25 m Line/Space Due to Adoption of Additive Process in Manufacturing These SLPs

7 Substrate-Like PCB Market, By Application
7.1 Introduction
7.2 Consumer Electronics
7.2.1 Consumer Electronics Expected to Hold Largest Size of SLP Market Owing to Adoption of SLP By Leading Original Equipment Manufacturers in Their Smartphones
7.3 Computing and Communications
7.3.1 Increasing Adoption of Advanced Communication Technologies Would Lead to High Demand for SLP for Computing and Communications Applications
7.4 Automotive
7.4.1 Increasing Demand for Multilayer Printed Circuit Boards in Automotive Electronics Will Spur SLP Market Growth
7.5 Medical
7.5.1 Rising Trend of Miniaturization of Advanced Medical Equipment and Devices Expected to Provide Opportunities for SLP Market Players
7.6 Industrial
7.6.1 Growing Trend of Iiot and Industry 4.0 to Drive Demand for SLP in Industrial Applications
7.7 Military, Defense, and Aerospace
7.7.1 North America to Lead SLP Market for Military, Defense and Aerospace Applications Due to Increasing Demand for High-Performance Printed Circuit Boards

8 Substrate-Like PCB Market, By Inspection Technology
8.1 Introduction
8.2 Automated Optical Inspection (AOI)
8.2.1 AOI Technology to Hold Largest Share of SLP Market Owing to Increased Interest of SLP Manufacturers in Adopting Advanced Inspection Technologies
8.3 Direct Imaging (DI) Or Laser Direct Imaging (LDI)
8.3.1 Sturdy Growth of Di in SLP Market Based on Inspection Technology as It Offers Optimal Quality at High Speed
8.4 Automated Optical Shaping (AOS)
8.4.1 SLP Market for AOS Technology to Grow at Highest CAGR Due to Its High Potential for Findings Faults and Shaping Copper Tracks

9 Geographic Analysis

10 Competitive Landscape
10.1 Overview
10.2 Ranking Analysis of Market Players
10.2.1 Product Launches/Developments
10.2.2 Agreements, Collaborations, Partnerships, and Contracts
10.2.3 Acquisitions
10.2.4 Expansions

11 Company Profiles
11.1 Overview
11.2 Key Players
11.2.1 Kinsus Interconnect Technology
11.2.2 Ibiden
11.2.3 Compeq
11.2.4 Unimicron
11.2.5 AT&S
11.2.6 TTM Technologies
11.2.7 Samsung Electro-Mechanics
11.2.8 Korea Circuit
11.2.9 Zhen Ding Technology
11.3 Other Players
11.3.1 Daeduck Gds Company
11.3.2 Isu Petasys
11.3.3 Tripod Technology Corp
11.3.4 LG Innotek

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