Complementary TranSwitch and Octasic Semiconductor Devices Deliver Hig

Complementary TranSwitch and Octasic Semiconductor Devices Deliver High Density Voice Gateway Card

    Business Editors/Telecommunications Writers

    SHELTON, Conn. & MONTREAL--(BUSINESS WIRE)--Feb. 15, 2005--

TranSwitch TEPro, Octasic OCT8304 and OCT6100 Interface Seamlessly in OEM Design and Field Trials
    TranSwitch(R) Corporation (NASDAQ: TXCC), and Octasic Semiconductor Inc. today announced an integrated solution for voice over packet (VoP) gateway implementations that allows OEMs to increase density and lower costs. Through the complementary fit and functionality of the TranSwitch TEPro(TM), Octasic OCT8304 and OCT6100 devices, the two semiconductor vendors are able to implement a gateway's voice processing functionality on a single card, using only three chips, resulting in a faster time to market for OEMs.
    The companies also announced that a leading manufacturer of PON optical line terminals (OLT) for use in fiber-to-the-premises (FTTP) applications has completed its design and field trials of a retrofittable DS3-rate high-density VoATM gateway using the TranSwitch/Octasic solution.
    "TEPro has proven to be an ideal TDM network interface device for voice gateways," said Brian Stroehlein, product marketing manager for TranSwitch. "By combining TEPro with Octasic's voice over packet (VoP) and echo cancellation (EC) devices on a common H.110 bus, OEMs can rapidly implement high density VoP gateways."
    The Octasic and TranSwitch devices are interconnected seamlessly with their common H.110 interfaces. H.110 is a versatile device-to-device interconnect for such applications, providing the full-duplex transfer of over 2,000 voice channels across one bus.
    "Octasic's devices combined with TranSwitch's TEPro greatly reduce time to market for equipment manufacturers due to the ease of integration," said Frederic Bourget, Octasic's director product management. "Together we provide an end-to-end solution from packet interfaces to Voice Processing to TDM."

    TranSwitch's TEPro, a RISC processor-based device, integrates:

--	Flexible (H.110, MVIP(TM), transmission, unframed) terminal interface
--	M13/G.747 multiplexer
--	DS3 framer with full C-bit functionality to support clear-channel DS3
--	28-channel DS1 framer
--	21-channel E1 framer
--	28-channel DS1/E1 cross-connect
--	672 DS0 x 4,096 time slot non-blocking cross-connect for grooming, concentration, switching and multiplexing
--	Message mailbox FIFO
--	Multi-channel HDLC for message-based signaling
--	High performance, on-chip RISC processor for flexible, programmable control

    On the line side, users may select one DS3, 28 DS1, or 21 E1 line interfaces. This density lets OEMs deliver optimal cost/performance with unmatched space and power efficiency - a critical advantage in designing denser, smaller systems.
    Octasic's OCT8304 Packetization Engine offers complete, standard compliant, AAL2 implementation at an unprecedented 1023 channel capacity, the highest capacity in voice packetization and aggregation on the market. The device provides standalone high-density G.711 packetization for VoIP and VoATM while enabling easy integration with devices where other requirements are needed. Octasic's OCT6100 Series Echo Canceller performs carrier-class transparent echo cancellation and Voice Quality Enhancements (VQE) with extremely low power and small board space requirements (16mm square footprint, the smallest in the industry). Some features include:

    -- 32-672 channels of G.168-2002 echo cancellation

    -- 128 ms tail/channel (on all channel densities)

    -- Adaptive noise reduction

    -- Extensive signaling tone detection/generation

    -- Octasic Music Protection, among a host of other features

    About Octasic

    Octasic Inc. is a privately held, fabless semiconductor company designing, marketing, and supporting best-in-class silicon solutions that deliver exceptional voice quality for network equipment providers within the wireless, VoP, and TDM segments of the telecommunications industry. Octasic's innovative approach involves processors that are optimized to perform key voice functions such as carrier-grade echo cancellation, packetization, and compression. For more information about Octasic and its products, please visit www.octasic.com.

    About TranSwitch

    TranSwitch Corporation designs, develops and markets innovative semiconductors that provide core functionality and complete solutions for voice, data and video communications network equipment. As a leading supplier to telecom, datacom, cable television and wireless markets, TranSwitch customers include the major OEMs that serve the worldwide public network, the Internet, and corporate Wide Area Networks (WANs). TranSwitch chips for Broadband, Transport and Switching are inherently flexible, many incorporating embedded programmable microcontrollers to rapidly meet customers' new requirements or evolving network standards by modifying a function via software instruction. TranSwitch implements global communications standards in its VLSI solutions and is committed to providing high-quality products and services. TranSwitch, Shelton, CT, is an ISO 9001:2000 registered company. For more information, visit www.transwitch.com.

    Forward-looking statements in this release, including statements regarding management's expectations for future financial results and the markets for TranSwitch's products, are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that these forward-looking statements regarding TranSwitch, its operations and its financial results involve risks and uncertainties, including without limitation risks of downturns in economic conditions generally and in the telecommunications and data communications markets and the semiconductor industry specifically; risks in product development and market acceptance of and demand for TranSwitch's products and products developed by TranSwitch's customers; risks relating to TranSwitch's indebtedness; risks of failing to attract and retain key managerial and technical personnel; risks associated with foreign sales and high customer concentration; risks associated with competition and competitive pricing pressures; risks associated with investing in new businesses; risks of dependence on third-party VLSI fabrication facilities; risks related to intellectual property rights and litigation; risks in technology development and commercialization; and other risks detailed in TranSwitch's filings with the Securities and Exchange Commission.

    TranSwitch is a registered trademark of TranSwitch Corporation. TEPro is a trademark of TranSwitch Corporation.

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CONTACT: TranSwitch Corporation Joyce Clark, 203-929-8810 ext. 2609 joyce.clark@transwitch.com or Octasic Semiconductor Paige McEachren, 514-282-8863 paige.mceachren@octasic.com

KEYWORD: CONNECTICUT INTERNATIONAL CANADA INDUSTRY KEYWORD: TELECOMMUNICATIONS NETWORKING INTERNET E-COMMERCE PRODUCT SOURCE: TranSwitch Corporation and Octasic Semiconductor Inc.

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