Altera, TSMC Team Up To Bring Advanced Packaging Technology To Arria 10 FPGAs

(RTTNews) - Altera Corp. (ALTR) and TSMC (TSM) Monday said they have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs.

Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance to Altera's 20 nm device family.

TSMC's leading-edge flip chip BGA package technology provides Arria 10 devices with better quality and reliability than standard copper bumping solutions through the use of fine-pitch copper bumps.

The technology is able to accommodate high bump counts as required by high-performance FPGA products. It also provides excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK layers, all critical features for products employing advanced silicon technologies.